Method and apparatus for showerhead cleaning

ABSTRACT

Embodiments of the present invention generally relate to a method and apparatus for ex-situ cleaning of a chamber component part. In one embodiment, a system for cleaning component parts in a cleaning chemistry is provided. The system comprises a wet bench set-up comprising a cleaning vessel assembly for holding one or more component parts to be cleaned during a cleaning process and a detachable cleaning cart detachably coupled with the cleaning vessel assembly for supplying one or more cleaning chemistries to the cleaning vessel assembly during the cleaning process.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims benefit of U.S. provisional patent applicationSer. No. 61/242,738 (Attorney Docket No. 14726L), filed Sep. 15, 2009,which is herein incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention generally relate to a method andapparatus for ex-situ cleaning of a chamber component. Moreparticularly, embodiments of the present invention generally relate to amethod and apparatus for ex-situ cleaning of a chamber component used ina semiconductor processing chamber.

2. Description of the Related Art

Plasma processing of semiconductor wafers in the manufacture ofmicroelectronic integrated circuits is used in dielectric etching, metaletching, chemical vapor deposition and other processes. In semiconductorsubstrate processing, the trend towards increasingly smaller featuresizes and line-widths has placed a premium on the ability to mask, etch,and deposit material on a semiconductor substrate, with greaterprecision.

Typically, etching is accomplished by applying radio frequency (RF)power to a working gas supplied to a low pressure processing region overa substrate supported by a support member. The resulting electric fieldcreates a reaction zone in the processing region that excites theworking gas into a plasma. The support member is biased to attract ionswithin the plasma towards the substrate supported thereon. Ions migratetowards a boundary layer of the plasma adjacent to the substrate andaccelerate upon leaving the boundary layer. The accelerated ions producethe energy required to remove, or etch, the material from the surface ofthe substrate. As the accelerated ions can etch other components withinthe processing chamber, it is important that the plasma be confined tothe processing region above the substrate. The etch gas is typicallydirected through a showerhead situated near the top of the chamber.Fluorine-based chemistries are generally used during etching processes.

However, the use of fluorine, while advantageous for the etchingprocess, reacts to form deposits in the narrow channels of theshowerhead and on other surfaces that are made of aluminum, a materialcommonly used in etch chambers. The aluminum fluoride deposits formed inthis manner have a generally rough surface topography. The rough surfaceof the aluminum fluoride deposits often blocks the channels of theshowerhead. Additionally, the aluminum fluoride deposits within the gaschannels become a source of particulate contamination. Current cleaningmethods either fail to adequately clean the deposits on the showerheador require significant system downtime, further resulting in increasedoverall production costs.

Therefore, there is a need for an improved apparatus and process forcleaning chamber components such as showerheads that providesignificantly less downtime for chamber maintenance and cleaning.

SUMMARY OF THE INVENTION

Embodiments of the present invention generally relate to a method andapparatus for ex-situ cleaning of a chamber component part. In oneembodiment, a system for cleaning component parts in a cleaningchemistry is provided. The system comprises a wet bench set-upcomprising a cleaning vessel assembly for holding one or more componentparts to be cleaned during a cleaning process and a detachable cleaningcart detachably coupled with the cleaning vessel assembly for supplyingone or more cleaning chemistries to the cleaning vessel assembly duringthe cleaning process.

In another embodiment, a system for cleaning component parts in acleaning chemistry is provided. The system comprises a wet bench set-upand a detachable cleaning cart. The wet bench set-up comprises acleaning vessel assembly for holding one or more component parts to becleaned during a cleaning process, comprising an outer cleaning basin, afirst cleaning basin circumscribed by the outer cleaning basin, and asecond cleaning basin circumscribed by the outer cleaning basin. Thedetachable cleaning cart is detachably coupled with the cleaning vesselassembly for supplying one or more cleaning chemistries to the cleaningvessel assembly during the cleaning process.

In yet another embodiment, a method for cleaning component parts in acleaning chemistry is provided. The method comprises providing acleaning vessel assembly for holding one or more component parts to becleaned during a cleaning process and providing a detachable cleaningcart detachably coupled with the cleaning vessel for supplying one ormore cleaning chemistries to the cleaning vessel assembly during thecleaning process. The cleaning vessel assembly comprises an outercleaning basin, a first cleaning basin circumscribed by the outercleaning basin, a second cleaning basin circumscribed by the outercleaning basin, and a transducer positioned within the outer cleaningbasin below the first cleaning basin and the second cleaning basin. Thedetachable cleaning cart comprises an inert gas module for supplying aninert gas, such as nitrogen (N₂) which may be used as a purge gas duringthe cleaning process, a deionized (DI) water supply module for supplyingdeionized water during the cleaning process, a first cleaning fluidsupply tank for supplying a first cleaning fluid to the first cleaningbasin, and a second cleaning fluid supply tank for supplying a secondcleaning fluid to the second cleaning basin. A first component part ispositioned in the first cleaning basin. A second component part ispositioned in the second cleaning basin. A first cleaning fluid isflowed from the first cleaning fluid supply tank into the first cleaningbasin. A second cleaning fluid is flowed from the second cleaning fluidsupply tank into the second cleaning basin. The transducer is cycled onand off to agitate the first cleaning fluid and the second cleaningfluid to clean the component parts and DI water is flowed from the DIwater supply module into the first cleaning basin and the secondcleaning basin to purge the first cleaning fluid from the first cleaningbasin and the second cleaning fluid from the second cleaning basin.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 is a schematic side view of one embodiment of a cleaning systemaccording to embodiments described herein;

FIG. 2 is a schematic side view of one embodiment of a wet bench set-upaccording to embodiments described herein;

FIG. 3 is a schematic side view of one embodiment of a detachablecleaning cart according to embodiments described herein; and

FIG. 4 is a schematic side view of another embodiment of a cleaningsystem according to embodiments described herein.

For clarity, identical reference numerals have been used, whereapplicable, to designate identical elements that are common betweenfigures. It is contemplated that features of one embodiment may beincorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

Embodiments described herein generally relate to a method and apparatusfor ex-situ cleaning of chamber component parts.

FIG. 1 is a schematic side view of a cleaning system 100 for ex-situcleaning of chamber component parts according to embodiments describedherein. In one embodiment, the one or more chamber component parts areused in a semiconductor processing chamber. In one embodiment, thechamber component parts comprise one or more showerheads. The chambercomponent parts may comprise a silicon carbide faceplate and an aluminumbase. In one embodiment, the chamber component part comprises copper. Inone embodiment, the cleaning system 100 comprises a wet bench set-up 200which comprises a cleaning vessel assembly 210 for holding the componentparts to be cleaned during the cleaning process and a detachablecleaning cart 300 detachably coupled with the wet bench set-up forsupplying the selected cleaning chemistry to the cleaning vesselassembly 210 during the cleaning process. The detachable cleaning cart300 is movable and may be detachably coupled with the cleaning vesselassembly 210 prior to and during the cleaning process and may be removedfrom the cleaning vessel assembly 210 when cleaning is not taking place.Thus the detachable cleaning cart 300 may be used to service differentcleaning vessels at different locations. Both the detachable cleaningcart 300 and the wet bench set-up 200 are described in further detailwith reference to FIG. 2 and FIG. 3.

FIG. 2 is a schematic side view of one embodiment of the wet benchset-up 200 according to embodiments described herein. The wet benchset-up 200 comprises a wet bench 202 and the cleaning vessel assembly210. The wet bench 202 provides support for the cleaning vessel assembly210. The wet bench 202 may also serve as an overflow basin for anycleaning chemicals which overflow the cleaning vessel assembly 210. Thewet bench 202 may also function as a fume hood when used in cleaningprocesses which generate gases and/or particulates. Although shown withthe wet bench 202, in certain embodiments, the cleaning vessel assembly210 is used in a stand alone fashion without the wet bench 202. Forexample, in well ventilated areas where there is less concern about thebuildup of fumes.

The wet bench 202 comprises a frame 204 which forms an overflow basin206 for both holding the cleaning vessel assembly 210 and capturing anyfluids which may overflow the cleaning vessel assembly 210 duringprocessing. The overflow basin 206 is fluidly coupled with a sink drainline 208 for removing any fluids captured by the overflow basin 206during cleaning.

The cleaning vessel assembly 210 comprises an outer cleaning basin 214which circumscribes a cleaning basin 215 that holds the component partto be cleaned, a transducer 216 positioned within the outer cleaningbasin 214, and a support 218 positioned within the outer cleaning basin214 for supporting the cleaning basin 215.

Although shown as cylindrical in FIG. 2, it should be understood thatthe outer cleaning basin 214 and/or the cleaning basin 215 may be anyshape, for example, square or rectangular. In one embodiment, the outercleaning basin 214 and/or the cleaning basin 215 may comprise a materialsuch as polyvinyl difluoride (PVDF) or any other materials compatiblewith process and cleaning chemistries.

The transducer 216 is configured to provide either ultrasonic ormegasonic energy to the cleaning region where the component part 220 ispositioned in the cleaning basin 215. The transducer 216 may beimplemented, for example, using piezoelectric actuators, or any othersuitable mechanism that can generate vibrations at ultrasonic ormegasonic frequencies of desired amplitude. The transducer 216 maycomprise a single transducer, as shown in FIG. 2, or an array ofmultiple transducers, oriented to direct ultrasonic energy into thecleaning region where the component part is positioned. When thetransducer 216 directs energy into the cleaning fluid in the cleaningbasin 215, acoustic streaming, i.e. streams of micro bubbles, within thecleaning fluid may be induced. The acoustic streaming aids the removalof contaminants from the component part 220 being processed and keepsthe removed particles in motion within the cleaning fluid hence avoidingreattachment of the of the removed particles to the component partsurface. The transducer 216 may be configured to direct ultrasonic ormegasonic energy in a direction normal to the edge of the component part220 or at an angle from normal. In one embodiment, the transducer 216 isdimensioned to be approximately equal in length to the diameter of thecomponent part 220 to be cleaned. The transducer 216 may be coupled toan RF power supply 222.

While only one transducer 216 is shown, multiple transducers may be usedwith certain embodiments. For example, additional transducers may beplaced in a vertical orientation along the side of the component part220 to direct ultrasonic or megasonic energy toward the component part220 from the side. The transducer 216 may be positioned outside of theouter cleaning basin 214. In one embodiment, the transducer 216 may bepositioned in the overflow basin 206 to direct ultrasonic or megasonicenergy toward the component part 220. Although the transducer 216 isshown as cylindrical, it should be understood that transducers of anyshape may be used with the embodiments described herein.

The wet bench set-up 200 also comprises one or more fluid delivery lines382 a, 384, 386 a, and 388 a for delivering cleaning fluids to the wetbench set-up and returning used cleaning fluids to the detachablecleaning cart 300 for recycling and reuse. The fluid delivery lines areconfigured to mate with corresponding fluid delivery lines 382 b, 386 b,and 388 b on the detachable cleaning cart 300 using, for example,connect fittings and disconnect couplings shown as a “Quick Connect”390.

FIG. 3 is a schematic side view of a detachable cleaning cart 300showing a fluid flow circuit schematic diagram according to embodimentsdescribed herein. In one embodiment, the detachable cleaning cart 300comprises a system controller 310 for controlling the cleaning processand a cleaning fluid supply module 320 for supplying and recyclingcleaning fluid. In one embodiment, the system controller 310 is separatefrom the detachable cleaning cart 300.

In general, the system controller 310 may be used to control one or morecontroller components found in the cleaning system 100. The systemcontroller 310 is generally designed to facilitate the control andautomation of the overall cleaning system 100 and typically includes acentral processing unit (CPU) (not shown), memory (not shown), andsupport circuits (or I/O) (not shown). The CPU may be one of any form ofcomputer processors that are used in industrial settings for controllingvarious system functions, substrate movement, chamber processes, andsupport hardware (e.g., sensors, robots, motors, lamps, etc.), andmonitor the processes (e.g., substrate support temperature, power supplyvariables, chamber process time, processing temperature, I/O signals,transducer power etc.). The memory is connected to the CPU, and may beone or more of a readily available memory, such as random access memory(RAM), read only memory (ROM), floppy disk, hard disk, or any other formof digital storage, local or remote. Software instructions and data canbe coded and stored within the memory for instructing the CPU. Thesupport circuits are also connected to the CPU for supporting theprocessor in a conventional manner. The support circuits may includecache, power supplies, clock circuits, input/output circuitry,subsystems, and the like. A program (or computer instructions) readableby the system controller 310 determines which tasks are performable on asubstrate. Preferably, the program is software readable by the systemcontroller 310 that includes code to perform tasks relating tomonitoring, execution and control of the movement, support, and/orpositioning of a substrate along with the various process recipe tasksand various chamber process recipe steps being performed in the cleaningsystem 100. In one embodiment, the system controller 310 also contains aplurality of programmable logic controllers (PLC's) that are used tolocally control one or more modules in the cleaning system 100.

In one embodiment, the system controller 310 comprises controllercomponents selected from at least one of the following: a PhotoMeghelicmeter 312, a leak alarm 314 for detecting leaks within the detachablecleaning cart, a programmable logic controller 316 for controlling theoverall cleaning system 100, and an in-line heat controller 318. In oneembodiment, the leak alarm 314 is electronically coupled with the cartsplenum leak sensor for detecting the presence of fluid in the bottom ofthe cart 300. In one embodiment, the system controller 310 is coupledwith the transducer 216 via communication line 380 and controls thepower supplied to the transducer 216.

In one embodiment, the cleaning fluid supply module 320 comprises aninert gas module 324 for supplying an inert gas, such as nitrogen (N₂)which may be used as a purge gas during the cleaning process, a DI watersupply module 326 for supplying deionized water during the cleaningprocess, and a cleaning fluid supply module 328 for supplying cleaningfluid and recycling used cleaning fluid.

With regard to the inert gas module 324, as discussed above, the use ofnitrogen is exemplary and any suitable carrier gas/purge gas may be usedwith the present system. In one embodiment, the inert gas is suppliedfrom a nitrogen gas source 330 to a main nitrogen gas supply line 332.In one embodiment, the nitrogen gas source comprises a facility nitrogensupply. In one embodiment, the nitrogen source may be a portable sourcecoupled with the detachable cleaning cart 300. In one embodiment, thenitrogen supply line 332 comprises a manual shutoff valve (not shown)and a filter (not shown) for filtering contaminants from the nitrogengas. A two-way valve 334 which may be an air operated valve is alsocoupled with the nitrogen supply line 332. When the two-way valve isopen, nitrogen gas flows through the supply line 324 and into the outercleaning basin 214. Nitrogen may be used in several differentapplications within the cleaning system. For example, the first nitrogenline 336 supplies nitrogen, which is used to flow heated nitrogen overthe liquid IPA during the vapor generation phase, to the first IPA vaporgenerator. The nitrogen supply line 332 may also contain additionalvalves, pressure regulators, pressure transducers, and pressureindicators which are not described in detail for the sake of brevity. Inone embodiment, nitrogen gas may be supplied to the outer cleaning basin214 via fluid supply line 384.

With regard to the DI water supply module 326, the use of DI water isexemplary and any fluid suitable for cleaning may be used with thepresent cleaning system 100. In one embodiment, the DI water is suppliedfrom a DI water supply module 326 to a main DI water supply line 339. Inone embodiment, the DI water source comprises a facility DI supply. Inone embodiment, the DI water source may be a portable source coupledwith the detachable cleaning cart 300. In one embodiment, the DI watersupply line 339 comprises a manual shutoff valve 340 and a heater 342for heating the DI water to a desired temperature for assisting in thecleaning process. The heater 342 may be in electronic communication withthe heat controller 318 for controlling the temperature. The DI watersupply line 339 further comprises a two-way valve 344 which may be anair operated valve which is used for controlling the flow of DI waterinto the outer cleaning basin 214. When the two-way valve 344 is open,DI water flows into the outer cleaning basin 214. When the two-way valve344 is closed and two-way valve 334 is open, nitrogen purge gas flowsinto the outer cleaning basin 214. The DI water supply line 339 may alsocontain additional valves, pressure regulators, pressure transducers,and pressure indicators which are not described in detail for the sakeof brevity. In one embodiment, DI water may flow into the outer cleaningbasin 214 via supply line 386.

The cleaning fluid supply module 328 comprises a cleaning fluid supplytank 346 for storing cleaning fluid, a filter system 348 for filteringused cleaning fluid, and a pump system 350 for pumping cleaning fluidinto and out of the cleaning fluid supply module 328. The cleaning fluidmay comprise deionized water (DIW), one or more solvents, a cleaningchemistry such as standard clean 1 (SC1), selective deposition removalreagent (SDR), surfactants, acids, bases, or any other chemical usefulfor removing contaminants and/or particulates from a component part.

In one embodiment, the cleaning fluid supply tank 346 is coupled with acleaning fluid supply 358 via a supply line 360. In one embodiment, thecleaning fluid supply line 360 comprises a manual shut-off valve 362 forcontrolling the flow of cleaning fluid into the cleaning fluid supplytank 346. The cleaning fluid supply line 360 may also contain additionalvalves, pressure regulators, pressure transducers, and pressureindicators which are not described in detail for the sake of brevity. Inone embodiment, the cleaning fluid supply tank 346 is coupled with theouter cleaning basin 214 via supply line 388.

In one embodiment, the cleaning fluid supply tank 346 is coupled with acleaning fluid supply drain 366 for removing cleaning fluid from thecleaning fluid supply tank 346. The flow of cleaning fluid through thecleaning fluid supply drain 366 is controlled by a manual shut-off valve368.

The cleaning fluid supply tank 346 may also include a plurality of fluidlevel sensors for detecting the level of processing fluid within thecleaning fluid supply tank 346. In one embodiment, the plurality offluid sensors may include a first fluid sensor 352 which indicates whenthe fluid supply is low and that the pump system 350 should be turnedoff. When the level of cleaning fluid is low, the first fluid levelsensor 352 may be used in a feedback loop to signal the cleaning fluidsupply 358 to deliver more cleaning fluid to the cleaning fluid supplytank 346. A second fluid level sensor 354 which indicates that thecleaning fluid supply tank 346 is full and the pump 350 should be turnedon. A third fluid sensor 356 which indicates that the cleaning fluidsupply tank 346 has been overfilled and that the pump 350 should beturned off. Although one fluid level sensor 234 is shown in theembodiment of FIG. 2, any number of fluid level sensors 234 may beincluded on the outer cleaning basin 214.

Used cleaning fluid may be returned from the outer cleaning basin 214 tothe filter system 348 where particulates and other contaminants may beremoved from the used cleaning fluid to produce renewed cleaning fluid.In one embodiment, used cleaning fluid may be returned from the overflowbasin via fluid recycling line 382. The recycling line 382 may alsocontain additional valves, pressure regulators, pressure transducers,and pressure indicators which are not described in detail for the sakeof brevity. After filtration, the renewed cleaning fluid may berecirculated back to the cleaning fluid supply tank 346 via a three-wayvalve 370. In one embodiment, the three-way valve 370 may also be usedin conjunction with the pump system 350 to recirculate fluid through thecleaning system to flush the cleaning system 100. In one embodiment, atwo-way valve 372 which may be an air operated valve may be used to suckDI water through the input of the pump system 350. In one embodiment, atwo-way valve 374 may be used to pump out DI water to drain.

In one embodiment, a component part 220 is placed on the support 218positioned within the cleaning basin 215. A cleaning cycle is commencedby flowing cleaning fluid into the cleaning basin 215. While thecleaning fluid is in the cleaning basin 215, the transducer 216 iscycled on/off to agitate the cleaning fluid. The cleaning fluid may bepurged from the cleaning basin 215 by flowing DI water into the tank.Nitrogen gas may also be used during the purge process. In oneembodiment, the cleaning/purge cycle is repeated sixteen times or untilthe showerhead has achieved a desired cleanliness.

FIG. 4 is a schematic side view of another embodiment of a cleaningsystem 400 according to embodiments described herein. The cleaningsystem 400 is similar to the cleaning system 100 except that thecleaning system 400 is adapted to simultaneously or sequentially cleanmultiple component parts in different cleaning basins. The cleaningsystem 400 also has the capability to supply different cleaningchemistries to each cleaning basin. In one embodiment, this is achievedby duplicating the fluid delivery system in the cleaning fluid supplymodule 320. Additional cleaning fluid supply modules may be added to thecleaning fluid supply module to supply cleaning fluids to the additionalcleaning basins. The additional hardware may be set-up in the sameconfiguration as the hardware depicted in FIG. 3 however; the additionalcleaning fluid delivery systems are generally in parallel with theinitial fluid delivery system of the cleaning fluid supply module 320.With this configuration, different cleaning chemistries may be suppliedto any one or more of the cleaning basins of the cleaning system 400.

In one embodiment, the cleaning system 400 comprises a wet bench set-up404 similar to wet bench set-up 200 which comprises a cleaning vesselassembly 410 similar to cleaning vessel assembly 210 for holdingmultiple component parts 420 a, 420 b to be cleaned during the cleaningprocess and a detachable cleaning cart 430 for supplying the selectedcleaning chemistry to the cleaning vessel assembly 410 during thecleaning process. The detachable cleaning cart 430 is movable and may bedetachably coupled with the cleaning vessel assembly 410 prior to andduring the cleaning process and may be removed from the cleaning vesselassembly 410 when cleaning is not taking place. Thus the detachablecleaning cart 430 may be used to service different cleaning vessels atdifferent locations.

The cleaning vessel assembly 410 comprises an outer cleaning basin 414similar to the outer cleaning basin 214, a transducer 416 similar totransducer 216 positioned within the outer cleaning basin 414, and afirst cleaning basin 415 a and a second cleaning basin 415 b positionedwithin the outer cleaning basin 414 for supporting a first componentpart 420 a and a second component part 420 b to be cleaned in eachrespective cleaning basin 415 a, 415 b.

The wet bench set-up 404 also comprises fluid delivery lines 440 a, 442a, 444 a, 446 a, and 448 a for delivering cleaning fluids to thecleaning vessel assembly 410 and returning used cleaning fluids to thedetachable cleaning cart 400 for recycling and reuse. The fluid deliverylines are configured to mate with corresponding fluid delivery lines 440b, 442 b, 444 b, 446 b, and 448 b on the detachable cleaning cart 430using, for example, connect fittings and disconnect couplings. The fluiddelivery lines 440 a, 442 a, 444 a, 446 a, 448 a, 440 b, 442 b, 444 b,446 b, and 448 b are similar to the aforementioned fluid delivery lines382 a, 384, 386 a, 388 a, 382 b, 386 b, and 388 b. Although five fluiddelivery lines are depicted any number of fluid delivery lines may beused.

The detachable cleaning cart 430 comprises a system controller 310 forcontrolling the cleaning process and a cleaning fluid supply module 450for supplying cleaning fluid to the cleaning vessel assembly 410 andrecycling used cleaning fluid delivered from the cleaning vesselassembly 410. The cleaning fluid supply module 450 is similar tocleaning fluid supply module 320.

The cleaning fluid supply module 450 comprises a first cleaning fluidsupply tank 452 a for supplying cleaning fluid to the first cleaningbasin 415 a and a second cleaning fluid supply tank 452 b for supplyingcleaning fluid to the second cleaning basin 415 b. The cleaning fluid ineach cleaning fluid supply tank 452 a, 452 b may comprise deionizedwater (DIW), one or more solvents, a cleaning chemistry such as standardclean 1 (SC-1), selective deposition removal reagent (SDR), surfactants,acids, bases, or any other chemical useful for removing contaminantsand/or particulates from a component part. In certain embodiments,different cleaning fluids may be simultaneously supplied to each of thecleaning basins 415 a, 415 b. In certain embodiments, the same cleaningfluid may be simultaneously supplied to each of the cleaning basins 415a, 415 b.

The cleaning fluid supply module 450 may further comprise a heated DIwater supply tank 456 for supplying heated DI water to each of the firstcleaning basin 415 a and the second cleaning basin 415 b. The cleaningfluid supply module 450 further comprises pumps 460 a, 460 b, 460 c, and460 d for controlling the flow of the various cleaning fluids which maybe monitored by the system controller 310.

It should be understood that the cleaning system 100 and the cleaningsystem 400 may further comprise pressure regulators, pressuretransducers, pressure indicators, valves, pumps and supply lines whichare not described in detail for the sake of brevity.

Multiple cleaning chemistry capability for a single cleaning platformhas several advantages in the area of semiconductor processing and otherprocessing areas where cleanliness is desirable. For example, theability to simultaneously provide different chemistries using a singledetachable cleaning cart allows for the simultaneous cleaning ofcomponent parts comprising different materials. The portability of thedetachable cleaning cart provides the capability to service differentcleaning vessels at different locations using a single detachablecleaning cart. The ability to process multiple component partssimultaneously leads to a decrease in chamber downtime and acorresponding decrease in the cost of ownership.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

We claim:
 1. A system for cleaning component parts in a cleaningchemistry comprising: a wet bench set-up comprising: a cleaning vesselassembly for holding one or more component parts to be cleaned during acleaning process; and a detachable cleaning cart detachably coupled withthe cleaning vessel assembly for supplying one or more cleaningchemistries to the cleaning vessel assembly during the cleaning process.2. The system of claim 1, wherein the component part is a showerhead. 3.The system of claim 1, wherein the wet bench set-up further comprises: aframe which forms an overflow basin for holding the cleaning vesselassembly and capturing any fluids which may overflow from the cleaningvessel assembly during processing; and a sink drain line for removingany fluids captured by the overflow basin during cleaning.
 4. The systemof claim 1, wherein the cleaning vessel assembly comprises: a firstcleaning basin for supporting a first component part to be cleaned; atransducer positioned below the first cleaning basin, a supportpositioned within the cleaning basin for supporting the component partto be cleaned.
 5. The system of claim 4, wherein the cleaning vesselassembly further comprises: a second cleaning basin for supporting asecond component part to be cleaned.
 6. The system of claim 4, whereinthe detachable cleaning cart comprises: a system controller forcontrolling the cleaning process; and a cleaning fluid supply module forsupplying and recycling cleaning fluid to the cleaning vessel assembly.7. The system of claim 6, wherein the cleaning fluid supply modulecomprises: an inert gas module for supplying an inert gas which may beused as a purge gas during the cleaning process; a deionized (DI) watersupply module for supplying deionized water during the cleaning process;and a first cleaning fluid supply tank for supplying cleaning fluid tothe first cleaning basin.
 8. The system of claim 7, wherein the cleaningfluid supply module comprises: a second cleaning fluid supply tank forsupplying cleaning fluid to the second cleaning basin.
 9. The system ofclaim 6, wherein the system controller comprises at least one of thefollowing: a PhotoMeghelic meter, a leak alarm for detecting leakswithin the detachable cleaning cart, a programmable logic controller forcontrolling the overall cleaning system, and an in-line heat controller.10. A system for cleaning component parts in a cleaning chemistrycomprising: a wet bench set-up comprising: a cleaning vessel assemblyfor holding one or more component parts to be cleaned during a cleaningprocess, comprising an outer cleaning basin; a first cleaning basincircumscribed by the outer cleaning basin; and a second cleaning basincircumscribed by the outer cleaning basin; and a detachable cleaningcart detachably coupled with the cleaning vessel assembly for supplyingone or more cleaning chemistries to the cleaning vessel assembly duringthe cleaning process.
 11. The system of claim 10, further comprising: atransducer positioned within the outer cleaning basin below the firstcleaning basin and the second cleaning basin.
 12. The system of claim10, wherein the detachable cleaning cart comprises: a system controllerfor controlling the cleaning process; and a cleaning fluid supply modulefor supplying cleaning fluid to the cleaning vessel assembly.
 13. Thesystem of claim 12, wherein the cleaning fluid supply module comprises:an inert gas module for supplying an inert gas which may be used as apurge gas during the cleaning process; a DI water supply module forsupplying deionized water during the cleaning process; a first cleaningfluid supply tank for supplying cleaning fluid to the first cleaningbasin; and a second cleaning fluid supply tank for supplying cleaningfluid to the second cleaning basin.
 14. The system of claim 12, whereinthe system controller comprises at least one of the following: aPhotoMeghelic meter, a leak alarm for detecting leaks within thedetachable cleaning cart, a programmable logic controller forcontrolling the overall cleaning system, and an in-line heat controller.15. The system of claim 10, wherein the wet bench set-up furthercomprises: a frame which forms an overflow basin for holding both thecleaning vessel assembly and capturing any fluids which may overflowfrom the cleaning vessel assembly during processing; and a sink drainline for removing any fluids captured by the overflow basin duringcleaning.